LED Wall for XR Stage and Virtual Production
XR LED Display Solution
We focused on provide the R&D, manufacture and sales of LED Display, also provide one-stop solution for your project.
Realistic & immersive visuals High Refresh Rate 7680Hz
High Contrast Ratio 6000:1 High Gray Scale 22 Bits Wide Color Gamut DIP-P3
Up to 40% energy savings with REISS COB!
Bidang Aplikasi
Benefits of COB
lmpact and surface protection
Anti-Collision /Anti-Dust /ater-Proof (Front lP54) COB Display is sealed by epoxy resin and has no bare pin, which protects the LEDs from water, dust, oil stain. collision and static electricity.
Easy to clean with water
Enables a much higher packing density than SMD
High resolution with better smoothness and highe intensity
Greater heat dissipation, better stability, reliability and longevity
What is COB
- C0B (Chips on Board) , is a new technology of LED packaging for LED light engine.
- The chip is mounted directly on the substrate on the back of the circui board
- Use ultrasonic welding technology to conduct lead bonding of the LED chip
- The resin glue encapsulates the lamp position and protects the LED chip
Larger Viewing Angle
COB package adopts the class of surface luminescence, so the viewing angle is wider, so that the COB encapsulated micro-pitchLED display screen has a vertical and horizontal bidirectional 170 ” wide viewing angle, which ensures that any angle of viewingno color deviation, the images and videos can always be displayed perfectly.
REISSDISPLAY LED Display Stunning Viusal Peformance
RElSSDlSPLAY Elevate visual experiences to new heights with our cutting-edge Paparan led, now DCl-P3 compliant. Designed todeliver unparalleled color briliance and accuracy, this state-of-the-art technology sets the stage for captivating and immersiveexperiences like never before.
Precise Size To Splice Seamlessly
REISSDISPLAY COB Series 16:9 Golden ratio, in line with HDTV standards, perfect display of 2k,4K,8K video.
COB VS SMD
Flip chip COB technology boasts an extended lifespan, minimal pixel failures,enhanced contrast ratio, reduced power consumption, and smoother image quality
Great Energy Efficiency
The flip chip COB packaging technology, combined with a common cathode circuit design, enhances display effects while Saving 40% energy than conventional Skrin LED
COB Micro Display Technology
Micro LED products based on COB micro display advanced technology adopt self-luminescence, high contrast and high cologamut, long life, high refresh rate, excellent display effect and unlimited size expansion, utrg-high pixel density and otheradvantages, more energy-saving and efficient, theater-level color management system, reaching 125% NTSC color gamut rangeand 22Bit color depth, presenting rich details and restoring real display effect
Hiah Contrast, Present More Details
VIVID Designed to awe and inspire, the RElSSDlSPLAY industry-leading contrast ratios and HDR capabilities transport you to a realmwhere every imgge bursts with ife, immersing you in g breathtaking tapestry of colors and details, say goodbve to ordinary ancembrace extraordinary with the RElSSDISPLAY LED display
Spesifikasi
| Pixel pitch（mm） | 0.95mm | 1.25mm | 1.5mm |
| LED Package | COB Technology | COB Technology | COB Technology |
| Brightness(nits) | 600 nits | 600 nits | 600 nits |
| Viewing Angle(H/V) | 170°/170° | 170°/170° | 170°/170° |
| Cabinets Solution | 640 x 360 | 480 x 270 | 384 x 216 |
| Refresh Rate(HZ) | 3840/7680 | 3840/7680 | 3840/7680 |
| Frame rate | 60Hz | 60Hz | 60Hz |
| Color temperature | 3000k-9300K | 3000k-9300K | 3000k-9300K |
| Unit size | 600×337.5x75mm | 600×337.5x75mm | 600×337.5x75mm |
| Unit size | 23.6” x 13.26” x 1.55” | 23.6” x 13.26” x 1.55” | 23.6” x 13.26” x 1.55” |
| Unit weight | 4kg / 8.8 lbs | 4kg / 8.8 lbs | 4kg / 8.8 lbs |
| Power Con(Avg) | 120W/㎡ | 115W/㎡ | 115W/㎡ |
| Power Con(Max) | 370W/㎡ | 345W/㎡ | 345W/㎡ |
| Input Voltage(AC) | 110V / 240V, 50/60 HZ | 110V / 240V, 50/60 HZ | 110V / 240V, 50/60 HZ |
| Working temperature | -10°~40°C/10%-90%RH | -10°~40°C/10%-90%RH | -10°~40°C/10%-90%RH |
| IP Rating | IP65/IP35 | IP54/IP31 | IP54/IP31 |
| Lifespan | 100,000 hrs | 100,000 hrs | 100,000 hrs |
| Jaminan | 5 years | 5 years | 5 years |
Relative projects
TV Station, Broadcasting, High-end commercial conference, Exhibition, Monitoring Command Center, etc
2 Minutes to Know More About COB LED Display
COB technology is an emerging LED packaging technology, which is different from traditional SMD surface mount packaging. So what are the advantages and disadvantages of COB LED display? How is it different from the SMD LED screen?
COB, Chip on Board, is a technology that is used to encapsulate a chip on a board.
Unlike SMD, where the beads are soldered to the PCB, the COB process first covers the silicon placement point with thermally conductive epoxy resin (silver-doped epoxy resin) on the substrate surface, then the LED chip is attached to the interconnected substrate with conductive or non-conductive adhesive through adhesive or solder.
Finally, the chip is electrically interconnected with the PCB board through lead (gold wire) bonding.
The LED wafer is fixed to the front surface of the display substrate and the film is pasted to the front surface of the display substrate, the LED wafer is a common red, green, or blue LED chip to achieve integrated packaging.
The COB packaging process breaks through the traditional packaging technology’s dependence on brackets and supports. So it reduces the number of soldering points.
The fewer welds, the fewer points of failure. Therefore, the stability and reliability of the COB modul LED are high, and the failure rate of the lamp surface is low.
1. different packaging methods;
2. ultra-micro pitch;
3. ultra-clear display screen;
4. the box is lighter and thinner than led small pitch;
5. small thermal resistance value, strong heat dissipation;
6. effective suppression of moiré, light sense superior;
7. small spacing, resulting in the screen ink color consistency is not beautiful;
8. the production process steps less, and the current stage of packaging technology needs to be improved;
9.COB display technology requirements are high, COB display manufacturers less;
Many customers who come into LEDs often hear about COB technology, which makes them confused about its differences from traditional Paparan LED.
In fact, what we are talking about is COB, which is an emerging packaging technology for LED displays.
In the past, LED displays used SMD surface mount packaging, so the comparison between COB displays and LED displays actually refers to the comparison between SMD packaging and COB
Comparison between COB and SMD LED Display
(1) Different Packaging Technology
Nowadays, our conventional LED display screens use surface-mount SMD packaging.
This packaging technology involves fixing the LED chip through a bracket, curing it with epoxy resin inside, and then fixing it on the PCB board with solder paste, followed by reflow soldering to evenly arrange the LED beads on the board.
However, this technology process is cumbersome, requires a certain amount of operation time, and the minimum distance between points can only be 1.2, even if it is multi in one, it can be done to a smaller size, But still unable to get rid of the problem of losing the lights.
COB packaging simplifies the packaging process of LED chips by directly integrating them onto the PCB board and fixing them with adhesive.
The entire process is simpler, without the need for reflow soldering, and the LED chips are more stable. At the same time, the spacing between points can also be smaller.
packaging. What are the differences between the two?
SMD is short for Surface Mounted Devices, where the LED packaging factory uses the SMD process to fix the bare chip to the holder, connect the two electrically via gold wire and finally protect them with epoxy resin.
SMD encapsulated small pitch products generally have the LED beads exposed or use a mask. SMD uses surface mount technology (SMT), which is highly automated and has the advantages of small size, large scattering angle, good luminous uniformity and high reliability.
The COB screen is a led screen made using the COB packaging method, while we now often say that the led screen is the use of SMD packaging led screen, the difference between the two is that the packaging method is different.
(2) Different Pixel Pitches
Ordinary SMD packaged LED displays are limited by packaging technology, and their point spacing is usually above P1.2, such as P1.2, P1.56, P1.875, P2.0, P3, P4, and so on.
Products with small spacing are affected by welding technology, and there may be phenomena such as light bead detachment.
Its development limitation is mainly that it cannot achieve point spacing below 1.0, resulting in the inability to further improve the screen resolution,
If it is a situation that requires high clarity in image quality, it is not very suitable.
The display screen packaged with COB can achieve smaller dot spacing, for example, the P1.2, PO.9, and PO.6 products .
(3) Production Cost
There are many steps in the production process of SMD LED, and the production cost is high.
Based on SMD, COB LED screen eliminates the concept of brackets, and does not have production processes such as electroplating, patching, and reflow soldering, which simplifies the production process.
The process of SMD LED display is mature, but the COB process is not popular yet, so the price of SMD LED products is cheaper than that of COB products.
(4) Product Reliability
According to the principle of reliability, the fewer control links a product has, the higher its reliability. The product reliability of the COB package is higher.
In the production, transportation, and installation of traditional LED display screens, due to the fact that the lamp beads are exposed to the surface, the lamp beads will fall off when touched by fingers or collide with other things during installation, resulting in a certain pixel not lighting up.
This is mainly because the lamp beads are welded to the PCB board, and collision can easily cause the lamp to fall out.
If you want to repair it later, you can only have technical personnel come to the site to weld or directly replace the unit board, Causing a high after-sales rate.
The display screen packaged with COB has better protective performance, and it will not cause the lamp beads to fall during installation and use, so its surface is also more collision resistant and its stability is greatly improved.
(5) Optical Properties
The SMD package pastes the LED lights one by one on the PCB board, which makes the light spot uneven.
The COB display uses glue dispensing to package the light-emitting chips on the same horizontal plane, making the light-emitting surface more uniform.
In addition, the COB LED video wall has good color consistency, a viewing angle close to 175°, and a good color mixing effect.
(6) Light Quality
The SMD package attaches multiple devices to the PCB, which may cause glare and ghosting. COB LED screen is an integrated package. It reduces light refraction.
Basically, the main difference between COB displays and LED displays is the above three points.
From the perspective of industry development, COB screens will be the mainstream direction in the future.
Compared with traditional surface mount technology displays, COB displays have many advantages such as high reliability, low cost, small spacing, wear resistance, impact resistance, and strong heat dissipation ability.
Compared to led screens, COB screens have a smaller pitch, better protection, and better heat dissipation.
In COB packaging and SMD packaging, COB packaging devices are completely enclosed, while SMD packaging devices are exposed on the screen surface, and COB packaging process steps are fewer.
Advantages of COB LED Screens
1. Smaller Pixel Pitch
- Enhanced Clarity and Color: COB (Chip-on-Board) LED screens can achieve a smaller pixel pitch, resulting in clearer, more detailed, and softer colors in the display.
- Technological Advantage: The limitations of SMD (Surface-Mount Device) technology restrict its ability to produce micro-pitch displays. COB technology overcomes these barriers, making small-pitch LED displays more feasible.
- Seamless Display: Without physical barriers between the light-emitting chips, COB displays have more pixels per unit, providing clearer and more delicate images.
2. Super-High Protection Ability
- Encapsulation: COB LED screens fully encapsulate the device in the PCB board, protecting against damage during transportation, installation, and disassembly. This prevents issues such as lamp fall-off and breakage.
- Ketahanan: From production to deployment, the high protection capability of COB screens minimizes product damage and reduces losses.
3. Better Display Effect
- Eye-Friendly Light Emission: The "surface" light source of COB screens effectively suppresses moiré patterns and is gentle on the eyes even when viewed up close.
- Full Display Pixels: COB small display screens provide visual effects comparable to LCD screens, with reduced light refraction and enhanced color quality.
- High-End Applications: The excellent visual effects make COB screens ideal for high-end applications, such as conference rooms, studios, and command centers.
4. More Convenient Maintenance
- Minimal Maintenance: The rigorous packaging of COB screens means they require almost no maintenance once deployed.
- Ease of Cleaning: Unlike SMD LED displays, which require careful module maintenance and cleaning, COB screens can be easily cleaned with a rag due to their smooth, epoxy resin-sealed surface.
5. Strong Heat Dissipation
- Efficient Heat Management: COB LED screens allow heat to pass directly through the PCB board without accumulating, ensuring better product longevity and reliability.
These advantages highlight why COB LED screens are becoming a preferred choice in the display industry, offering superior performance, durability, and ease of maintenance.
Challenges in Adopting COB LED Screen Technology
- Immature Packaging Technology:
- COB (Chip-on-Board) LED screens represent a new display technology. However, the current packaging technology is not as refined as SMD (Surface-Mount Device) technology. This results in high technical requirements and significant research and development costs.
2. Transition Costs:
- The production steps in the SMD packaging process differ from those required for COB technology. Enterprises transitioning to COB will face separation from their original production bases, leading to high transformation costs and a limited number of manufacturers capable of making the switch.
3. Color Consistency Challenges:
- For LED displays with a pixel pitch below 2mm, whether using SMD or COB technology, maintaining consistent screen ink color is crucial and requires strict control.
4. Higher Costs:
- The price of COB screens is 10-20% higher than that of LED displays with the same pixel pitch using SMD technology.
The Advantages of Flip-Chip COB LEDs in the Micro-Pitch Display Market
In the rapidly evolving micro-pitch display market, particularly for products with pixel pitches below P1.0mm, COB (Chip-on-Board) technology stands out with significant advantages over SMD (Surface-Mount Device) and GOB (Glue-on-Board) LED displays. As a core technology route for small-pitch products, COB technology has advanced significantly, differentiating into front-mount chip and flip-chip technologies.
Understanding Front-Mount Chip and Flip-Chip Technologies
What is an LED Front-Mount Chip?
A front-mount chip features both the electrode and the light-emitting surface on the same side of the chip. The electrodes are connected to the substrate via wire bonding.
What is an LED Flip-Chip?
In a flip-chip configuration, the light-emitting surface faces up while the electrode faces down, effectively inverting the front-mounted chip design. This configuration eliminates the need for wire bonding, offering several advantages:
- Higher Stability: No wiring required, which reduces potential failure points.
- Higher Luminous Efficiency: Enhanced light output with lower energy consumption.
- Wider Electrode Spacing: Reduces the risk of lamp bead failure, contributing to overall reliability.
Why Flip-Chip COB LEDs Represent the Future of Displays
Flip-chip COB technology builds on the strengths of traditional COB, pushing the boundaries of display performance. As an advanced iteration of COB, flip-chip COB LEDs achieve true chip-level gaps, offering distinct benefits that align with consumer demands for superior visual quality, wider viewing angles, and better near-screen experiences.
Key Advantages of Flip-Chip COB LEDs
Ultra-High Reliability:
Thinner and lighter packaging reduces thermal resistance and extends display lifespan.
Superior protection against water, collisions, shocks, dust, and static.
Excellent Display Quality:
Achieves ultra-high contrast ratios (20,000:1), enhancing light and dark contrast details for a superior visual experience.
HDR digital image technology ensures fine and perfect quality for both static and high-dynamic images.
Ultra-Small Dot Pitch:
Higher pixel density makes flip-chip COB LEDs ideal for applications with pixel pitches below 1.0mm.
Super Energy Efficiency:
Reduces power consumption by 45% under the same brightness conditions.
Offers good viewing angles and uniform side-view display, making it suitable for indoor, near-screen applications.
Kesimpulan
COB LED video walls, characterized by their lightweight, thin profile, and robust resistance to collision and pressure, offer excellent display quality and are particularly advantageous in small-pitch display fields. While there are still technical challenges to overcome, the future of COB LED displays looks promising and is poised to bring more innovations to the display industry.
By addressing consumer demands and leveraging the unique benefits of flip-chip COB technology, these displays are set to become a dominant force in the market, offering enhanced visual experiences and superior reliability.
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